Postgraduate Study and Professional Training Scholarship

The Li Po Chun Charitable Trust Fund has an opening research position. The duration of this scholarship is 6 months to 2 years. This position is available for all students around the world. The deadline for applying is February 06, 2015.

This Fund established in 1963, provides scholarships for selected candidates to pursue postgraduate studies in universities or institutions overseas. The aim of the Scholarships is to provide annual awards to selected candidates to pursue a postgraduate course at a recognized university or institution overseas (Courses offered by institutions overseas taken by distance-learning mode in Hong Kong would not be considered).

The maximum value of an award will be HK$ 120,000 per year.

The award will normally be tenable for a period not exceeding two years and not less than six months. The award will normally be tenable for a period not exceeding two years and not less than six months.

Application Requirements
- Hong Kong residents having resided in Hong Kong for a continuous period of not less than 7 years;.
- Holders of either a degree from a university in Hong Kong or recognized equivalent qualifications;.
- In possession of substantial practical working experience in the relevant field of study;.
- Eligible for admission to the intended course of study; and.
- Available to attend an interview to be conducted in Hong Kong.
- Scholarship Open for International Students: Citizens of Hong Kong can apply for this scholarship.

How to apply?
The hard copies of the applications must be submitted either by mail or by hand and by post. One complete set of the following documents should be submitted.
- The application form.
- The Form of Proposal.
- The Acknowledgement of Application (* would be sent to the applicant within 2 weeks upon receipt of the application). Submission via e-mail or by fax and incomplete applications would not be considered. All documents, including the application form, would not be returned upon the submission.

Scholarship Summary

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